Adhesive Film FALDA™ Epoxy Heat Cure Type Adhesive Film
Long-term High Heat Resistance TypeFALDA™

Through use of special thermoplastic resin with long-term heat resistance and a thermosetting resin polymer alloy technology principally consisting of epoxy, we have implemented unprecedented long-term heat resistance reliability of over 1,000 hours at 175°C.

Power Device Applications
Ideal for power devices and automotive ICs/electronic components that are used for long periods under high heat.
Adhesive Film
Electronic Component Applications
High stress mitigation and excellent high heat resistance make it ideal for MEMS and chip sealing.
Adhesive Film

Features

  1. Compared to standard epoxy resin, there is little deterioration at high temperatures of 150°C to 175°C.
  2. With high stress mitigation, it follows the unevenness of chips well when laminating.
  3. Superior flexibility mitigates the CTE mismatch generated when adhering disparate materials.
FALDA™ TSA-16 (Heat-resistant type)
TSA-16 (Heat-resistant type)
Standard epoxy resin
Standard epoxy resin

Representative Characteristics

Product No. TSA-16 TSA-18 TSA-19 Notes
Features High Adhesion
Displays high adhesion with a thin film of 20 µm
High Heat Resistance
Highest heat resistance in the heat-resistant series
Stress Mitigation
Suitable for bonding of materials with large linear expansion differences, and large materials
Adhesion after curing N/cm 18 10 20 Sample:
PI film 75 µm/
"TSA"/Ni-Cu plate
5 mm width, 90° delamination
Reflow Resistance °C 260 260 260 JEDEC LEVEL3
Glass Transition Temperature °C 30, 130 20 -4 DMA Method
After thermosetting
Storage Modulus (MPa)
-70°C 6,000 3,200 2,600
150°C 5 1 1
Water Absorption Ratio % 1.2 1.2 1.2 Weight increase after
85°C/85%RH/48hr
Heat-resistance test conditions 150°C 500 h 175°C 1,000 h 150°C 1,000 h -
State after heat resistance test - No delamination No delamination No delamination Sample:
Ceramic/
Adhesive/IC
Thermal
Cycling
after heat-resistance test
-40°C⇔125°C 1,000 cycles ≤ 1,000 cycles ≤ 1,000 cycles ≤
-40°C⇔150°C 500 cycles ≤ 1,000 cycles ≤ 1,000 cycles ≤
-40°C⇔175°C - 1,000 cycles ≤ -
Recommended Curing Conditions 100°C 1 hr + 170°C 2 hr -