Adhesive Film FALDA™ Epoxy Heat Cure Type Adhesive Film
Long-term High Heat Resistance Type
Overview
Through use of special thermoplastic resin with long-term heat resistance and a thermosetting resin polymer alloy technology principally consisting of epoxy, we have implemented unprecedented long-term heat resistance reliability of over 1,000 hours at 175°C.
Ideal for power devices and automotive ICs/electronic components that are used for long periods under high heat.
High stress mitigation and excellent high heat resistance make it ideal for MEMS and chip sealing.
Features
- Compared to standard epoxy resin, there is little deterioration at high temperatures of 150°C to 175°C.
- With high stress mitigation, it follows the unevenness of chips well when laminating.
- Superior flexibility mitigates the CTE mismatch generated when adhering disparate materials.
Representative Characteristics
| Product No. | TSA-16 | TSA-18 | TSA-19 | Notes | |
|---|---|---|---|---|---|
| Features | High Adhesion Displays high adhesion with a thin film of 20 µm |
High Heat Resistance Highest heat resistance in the heat-resistant series |
Stress Mitigation Suitable for bonding of materials with large linear expansion differences, and large materials |
||
| Adhesion after curing | N/cm | 18 | 10 | 20 | Sample: PI film 75 µm/ "TSA"/Ni-Cu plate 5 mm width, 90° release |
| Reflow Resistance | °C | 260 | 260 | 260 | JEDEC LEVEL3 |
| Glass Transition Temperature | °C | 30, 130 | 20 | -4 | DMA Method |
| After thermosetting Storage Modulus (MPa) |
-70°C | 6,000 | 3,200 | 2,600 | |
| 150°C | 5 | 1 | 1 | ||
| Water Absorption Ratio | % | 1.2 | 1.2 | 1.2 | Weight increase after 85°C/85%RH/48hr |
| Heat-resistance test conditions | 150°C 500 h | 175°C 1,000 h | 150°C 1,000 h | - | |
| State after heat resistance test | - | No release | No release | No release | Sample: Ceramic/ Adhesive/IC |
| Thermal Cycling after heat-resistance test |
-40°C⇔125°C | 1,000 cycles ≤ | 1,000 cycles ≤ | 1,000 cycles ≤ | |
| -40°C⇔150°C | 500 cycles ≤ | 1,000 cycles ≤ | 1,000 cycles ≤ | ||
| -40°C⇔175°C | - | 1,000 cycles ≤ | - | ||
| Recommended Curing Conditions | 100°C 1 hr + 170°C 2 hr | - | |||