Adhesive Film FALDA™ Epoxy Heat Cure Type Adhesive Film
Long-term High Heat Resistance Type
Through use of special thermoplastic resin with long-term heat resistance and a thermosetting resin polymer alloy technology principally consisting of epoxy, we have implemented unprecedented long-term heat resistance reliability of over 1,000 hours at 175°C.
- Compared to standard epoxy resin, there is little deterioration at high temperatures of 150°C to 175°C.
- With high stress mitigation, it follows the unevenness of chips well when laminating.
- Superior flexibility mitigates the CTE mismatch generated when adhering disparate materials.
Displays high adhesion with a thin film of 20 µm
|High Heat Resistance
Highest heat resistance in the heat-resistant series
Suitable for bonding of materials with large linear expansion differences, and large materials
|Adhesion after curing||N/cm||18||10||20||Sample:
PI film 75 µm/
5 mm width, 90° release
|Reflow Resistance||°C||260||260||260||JEDEC LEVEL3|
|Glass Transition Temperature||°C||30, 130||20||-4||DMA Method|
Storage Modulus (MPa)
|Water Absorption Ratio||%||1.2||1.2||1.2||Weight increase after
|Heat-resistance test conditions||150°C 500 h||175°C 1,000 h||150°C 1,000 h||-|
|State after heat resistance test||-||No release||No release||No release||Sample:
after heat-resistance test
|-40°C⇔125°C||1,000 cycles ≤||1,000 cycles ≤||1,000 cycles ≤|
|-40°C⇔150°C||500 cycles ≤||1,000 cycles ≤||1,000 cycles ≤|
|-40°C⇔175°C||-||1,000 cycles ≤||-|
|Recommended Curing Conditions||100°C 1 hr + 170°C 2 hr||-|