Adhesive Film FALDA™ Epoxy Heat Cure Type Adhesive Film
Fast Curing Type
By implementing a curing system and eliminating the need for heat treatment, we have achieved an adhesive sheet that preserves the characteristics of standard epoxy adhesives, but that can be processed with only approximately 1 minute of pressing.
Features
- Resists reflow and can bond in a short time, making it ideal for automotive products.
Reduces processing time
Example Process
Representative Characteristics
| Product No. | TSA-66 | Notes | |
|---|---|---|---|
| Adhesion after curing | N/cm | After pressing: 13 After reflow: 20 |
Sample: PI film 75 μm/ "TSA"/Ni-Cu plate 5 mm width, 90° delamination |
| Reflow Resistance | °C | 260 | Sample: PI film 75 μm/ "TSA"/Ni-Cu plate 180°C 1 min press product, JEDEC LEVEL3 |
| Glass Transition Temperature | °C | 50 | DMA Method |
| After thermosetting Storage Modulus of Elasticity (MPa) |
-40°C | 5,200 | |
| 150°C | 3 | ||
| Water Absorption Ratio | % | 1 | Weight increase after 85°C/85%RH/48hr |
| Recommended Curing Conditions | Press Cure | ≥ 180°C, 1 min |