Adhesive Film FALDA™ Epoxy Heat Cure Type Adhesive Film
Fast Curing TypeFALDA™

Overview

By implementing a curing system and eliminating the need for heat treatment, we have achieved an adhesive sheet that preserves the characteristics of standard epoxy adhesives, but that can be processed with only approximately 1 minute of pressing.

Features

  1. Resists reflow and can bond in a short time, making it ideal for automotive products.

Reduces processing time

Bond processing temperature, time
Bond processing temperature, time
Adhesion strength transition according to processing temperature
Adhesion strength transition according to processing temperature

Example Process

Example Process

Representative Characteristics

Product No. TSA-66 Notes
Adhesion after curing N/cm After pressing: 13
After reflow: 20
Sample: PI film 75 μm/
"TSA"/Ni-Cu plate
5 mm width, 90° release
Reflow Resistance °C 260 Sample: PI film 75 μm/
"TSA"/Ni-Cu plate
180°C 1 min press product, JEDEC LEVEL3
Glass Transition Temperature °C 50 DMA Method
After thermosetting
Storage Modulus of Elasticity (MPa)
-40°C 5,200
150°C 3
Water Absorption Ratio % 1 Weight increase after 85°C/85%RH/48hr
Recommended Curing Conditions Press Cure ≥ 180°C, 1 min