Adhesive Film FALDA™ Epoxy Heat Cure Type Adhesive Film
Room-Temperature Storage Type
Overview
Achieves a long room-temperature shelf life and good processability despite being a thermoset-type resin.
Features
- Superior room-temperature storage stability
*Less that a 5% decrease in adhesive strength after storage at room temperature (23°C) for 100 days.Shelf - Excellent fluidity, allowing for various processing such as lamination and pressing.
Low tackiness for superior processability in lamination, etc. Has excellent fluidity, which allows for the selection of various processing methods such as lamination and pressing. * 10°C/min temperature rise
* This is a measurement value and not a guaranteed value.As the viscosity from warming rapidly drops, it can easily enter the gaps even on adherends with uneven surfaces, increasing the adhesion.
Representative Characteristics
Product No. | TSA-5A | Notes | |
---|---|---|---|
Adhesion after curing | N/cm | 13 N/cm | Sample: PI film 75 µm/ "TSA"/35 µm electrolytic copper foil plate 5 mm width, 90° release |
Reflow Resistance | °C | 260°C | JEDEC LEVEL3 |
Glass Transition Temperature | °C | 80°C | DMA Method |
After thermosetting Shelf Stability (MPA) |
-40°C | 2,000 Mpa | |
25°C | 700 Mpa | ||
150°C | 2 MPa | ||
Water Absorption Ratio | % | 1% | Weight Increase Ratio after 85°C 85% RH48hr |