Photodefinable Conductive Material RAYBRID™ Wiring Formation Film
RAYBRID™ film for wiring formation (DFAG) is a film with photodefinable and conductive characteristics. It offers a solution for forming refined wiring patterns on base materials that could not be formed on in the past.
Features
- It is possible to transfer a pattern created on the easy delamination film with photo lithography to the desired base material.
- Can transfer patterns to curved base materials and edges.
- It is possible to transfer wiring patterns with a pitch 30 µm.
Applications/Usage
DFAG has protective film on one surface. Please remove the protective film before use. Also, RAYBRID© patterns formed on the easy delamination film with heated lamination (120°C to 140°C) can be transferred.
Process
Image of pattern formation on base part edge
Technology Information
Product Characteristics
Item | Characteristics |
---|---|
Resolution | Wiring Pattern: Line/Space = 15 µm/15 µm Independent Pattern: Line = 15 µm |
Electrical Resistance | Resistivity: 100 µΩ·cm Sheet Resistance: 0.4Ω/□ |
Heat Cure Conditions | 140°C |
Base Material Construction
Material | Film Thickness | |
---|---|---|
Protective film | PP | 40 µm |
RAYBRID™ | Photodefinable Conductive Material | 3 to 6 µm |
Easy Release Film | PET | 16,125 µm |
The structure/characteristics data noted are representative values. As the characteristics differ by product, we will recommend the ideal product to suit the customer's application. Please contact us for details.