Photosensitive Conductive Material RAYBRID™ Wiring Formation Film
RAYBRID™ film for wiring formation (DFAG) is a film with photosensitive and conductive characteristics. It offers a solution for forming refined wiring patterns on base materials that could not be formed on in the past.
- It is possible to transfer a pattern created on the easy release film with photo lithography to the desired base material.
- Can transfer patterns to curved base materials and edges.
- It is possible to transfer wiring patterns with a pitch 30 µm.
DFAG has protective film on one surface. Please remove the protective film before use. Also, RAYBRID© patterns formed on the easy release film with heated lamination (120°C to 140°C) can be transferred.
Image of pattern formation on base part edge
|Resolution||Wiring Pattern: Line/Space = 15 µm/15 µm
Independent Pattern: Line = 15 µm
|Electrical Resistance||Resistivity: 100 µΩ·cm
Sheet Resistance: 0.4Ω/□
|Heat Cure Conditions||140°C|
Base Material Construction
|Protective film||PP||40 µm|
|RAYBRID™||Photosensitive Conductive Material||3 to 6 µm|
|Easy Release Film||PET||16,125 µm|
The structure/characteristics data noted are representative values. As the characteristics differ by product, we will recommend the ideal product to suit the customer's application. Please contact us for details.