Photodefinable Conductive Material RAYBRID™ Paste for Metal Mesh
RAYBRID™ paste for metal mesh (SFAG Series) is a conductive paste with photodefinable characteristics. Toray's proprietary polymer design technology allows the formation of high-definition wiring, provides an alternative to ITO, and is used mainly for touch panel metal mesh applications, etc.
Features
- High-definition wiring formation is possible with photolitho processing after coating with a slit coater.
- High-definition formation is possible with Toray's proprietary polymer design technology.
- As it has lower resistance than ITO, it is suitable for large touch panels in automobiles, etc.
- Because it is a material with good flexibility, is it suitable for flexible sensors.
Applications/Usage
After applying RAYBRID™ evenly to the glass or polyimide board with a slit coater, etc., form the desired pattern with photolitho. Then cure the pattern by applying a baking step of 230°C before use.
Process
Printing Method:
Slit coater
Spin coater
Drying Method:
Hot Plate
Exposure Method:
Proxy
Nega Type
Developing Method:
TMAH Developing
Cure Method:
Oven,
Recommended Conditions:
230°C 60 min
Refined Wiring Formation Image
Application Examples: Car navigation touch sensor
Technology Information
| Item | Characteristics |
|---|---|
| Resolution | Line/Space = 8 µm/8 µm Line Width = 2~4 µm |
| Electrical Resistance | Resistivity: 30 µΩ·cm Sheet Resistance: 0.6Ω/□@0.5 um *Resistance value at beta film |
| Folding Characteristics | Φ2.0mm mm 200,000 times, no change to resistance value *Material: Polyimide 10 µm thickness |
| Thermoset Temperature | 230°C |
Visibility contrast with ITO electrode
Fold Rating Method
· Material was polyimide with a thickness of 10 µm
The structure/characteristics data noted are representative values. As the characteristics differ by product, we will recommend the ideal product to suit the customer's application. Please contact us for details.