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Thick Film Photodefinable Polyimide

Technological Elements

This is a negative-type photodefinable material that can be processed with a maximum film thickness of 500 µm and an aspect ratio of 36 using photolithography. By leveraging the high reliability of polyimides (heat resistance, chemical resistance, mechanical strength, insulation properties, and X-ray resistance), it is expected to be expanded into insulating materials for semiconductors/electronic components and structural materials for MEMS devices.　This contributes to new design flexibility and improved performance of next-generation electronic devices.

Features

1. Thick film microfabrication
High-precision pattern formation is possible even for films thicker than 100 µm.
2. Flexible shape design
Complex shapes and fine structures are realized by utilizing photolithography technology.
3. Improved safety and reduced facility costs
The alkali development method eliminates the need for explosion-proof equipment, enhancing safety.
4. High reliability material
Polyimide resin is used to provide excellent heat resistance, chemical resistance, and mechanical strength.

Applications/Usage

Resist material with high reliability and compatible with various plating processes.
By increasing film thickness, high aspect ratio microprocessing is possible, enabling application as a core material, which was difficult with existing resists.

Usage Method Diagram

Processing example (Film thickness: 500 µm)

Grid processing (14 µm/160 µm)

Processing example (Film thickness: 200 µm)

Cross Section
➡⇩

Coil processing (10 µm/100 µm)

Cross Section
➡⇩

Via processing (Φ70 µm)

Technology Information

	STF-1000	STF-2000
Features	High aspect ratio compatible	PFAS-free
NMP-free	〇	〇
Exposure wavelength	h-line (405 nm)	h-line (405 nm)
Developer	Alkali	Alkali
Film Thickness [μm]	≤ 500	≤ 200
Storage conditions	Frozen (≤ -15°C)	Frozen (≤ -15°C)

	STF-1000	STF-2000
Tensile Strength [MPa]	90 to 100	30 to 40
Elongation [%]	6.0 to 8.0	1.5 to 2.5
Elastic Modulus [GPa]	2.0 to 2.5	2.0 to 2.5
CTE [ppm/°C]	70 to 75	70 to 75
Glass Transition Temperature [°C]	200 to 250	200 to 250
5% Weight Reduction Temperature [°C]	280 to 330	280 to 330