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- Photodefinable Polyimide PHOTONEECE™
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Photodefinable Polyimide PHOTONEECE™
Technological Elements
- PHOTONEECE™ is a photodefinable polyimide coating material developed through a concentration of unique design technologies for polyimide heat-resistant resin and photosensitive control. We have a lineup of various products to suit your needs, including the positive-type "PW Series" and "LT Series," and the negative-type "PN Series." These have been used for many years as protective films and insulation films for semiconductors/electronic components.
Features
1. High reliability (heat resistance, mechanical properties, insulation properties, chemical resistance)
2. World-class photosensitivity and high patterning dimensional stability
3. A varied product lineup to match the application and process
Applications/Usage
<Usage Method>

<Applications>
• Semiconductor Surface Protection Film (Buffer Coating)
• Wafer/Panel Level Package Redistribution Layer (RDL)
• Electronic Component Interlayer Insulation Film, Hollow Structure Formation Applications
Semiconductor Buffer Coating

Electronic Components

Redistribution Layer (RDL)

Technology Information
<Product Characteristics>
Standard Materials
| GN Series | LT Series | PW Series | |
|---|---|---|---|
| Features | Thick film applicable, high heat resistance | Low-temperature curable, high resolution | High sensitivity, high resolution |
| Exposure Type | Negative type | Positive type | Positive type |
| Developer | Alkali | Alkali | Alkali |
| Cure Temperature [°C] | ≥ 300 | ≥ 200 | ≥ 300 |
| Film Thickness [μm] | 8 to 20 | 1 to 11 | 1 to 11 |
| Resolution [μm] | ≥ 30 | ≥ 5 | ≥ 5 |
| GN Series | LT Series | PW Series | |
|---|---|---|---|
| Tensile Strength [MPa] | ≥ 150 | ≥ 130 | ≥ 150 |
| Elongation [%] | ≥ 40 | ≥ 50 | ≥ 50 |
| Elastic Modulus [GPa] | ≥ 3 | ≥ 2 | ≥ 3 |
| CTE [ppm/°C] | ≤ 50 | ≤ 50 | ≤ 40 |
| Glass Transition Temperature [°C] | ≥ 300 | ≥ 270 | ≥ 300 |
| 5% Weight Reduction Temperature [°C] | ≥ 500 | ≥ 350 | ≥ 450 |
Fluorine-free
| GN-K Series | LT-K Series | PW-K Series | |
|---|---|---|---|
| Features | Low-temperature curable, thick film applicable | Low-temperature curable, high resolution | High sensitivity, high resolution |
| NMP-free | 〇 | 〇 | 〇 |
| Exposure Type | Negative type | Positive type | Positive type |
| Developer | Alkali | Alkali | Alkali |
| Cure Temperature [°C] | ≥ 200 | ≥ 200 | ≥ 300 |
Related Products
Related Information
-
- 2026
- 04.09
Press Release
High Thermal Resistant, and Low-Residual Stress Photo-definable Polyimide Sealing Material
-
- 2025
- 11.27
Press Release
Toray Develops Temporary Bonding Material for Uniformly Ultra-Thin Semiconductor Wafers
-
- 2024
- 10.23
Press Release
Toray Jointly Develops High-Speed Mounting Technology to Expand Silicon Photonics
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- Technology Information
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