PRODUCTS

Photodefinable Polyimide PHOTONEECE™

PHOTONEECE™
PHOTONEECE™ is a photodefinable polyimide coating material developed through a concentration of unique design technologies for polyimide heat-resistant resin and photosensitive control. We have a lineup of various products to suit your needs, including the positive-type "PW Series" and "LT Series," and the negative-type "PN Series." These have been used for many years as protective films and insulation films for semiconductors/electronic components.

Features

1. High reliability (heat resistance, mechanical properties, insulation properties, chemical resistance)
2. World-class photosensitivity and high patterning dimensional stability
3. A varied product lineup to match the application and process

Applications/Usage

<Usage Method>

Usage Method Diagram

<Applications>

• Semiconductor Surface Protection Film (Buffer Coating)
• Wafer/Panel Level Package Redistribution Layer (RDL)
• Electronic Component Interlayer Insulation Film, Hollow Structure Formation Applications 

Semiconductor Buffer Coating
PHOTONEECE, SEMICOFINE Semiconductor Buffer Coating Diagram

Electronic Components
PHOTONEECE, SEMICOFINE Electronic Components Diagram

Redistribution Layer (RDL)
PHOTONEECE, SEMICOFINE Redistribution Layer (RDL) Diagram

Technology Information

<Product Characteristics>

Standard Materials

GN Series LT Series PW Series
Features Thick film applicable, high heat resistance Low-temperature curable, high resolution High sensitivity, high resolution
Exposure Type Negative type Positive type Positive type
Developer Alkali Alkali Alkali
Cure Temperature [°C] ≥ 300 ≥ 200 ≥ 300
Film Thickness [μm] 8 to 20 1 to 11 1 to 11
Resolution [μm] ≥ 30 ≥ 5 ≥ 5
GN Series LT Series PW Series
Tensile Strength [MPa] ≥ 150 ≥ 130 ≥ 150
Elongation [%] ≥ 40 ≥ 50 ≥ 50
Elastic Modulus [GPa] ≥ 3 ≥ 2 ≥ 3
CTE [ppm/°C] ≤ 50 ≤ 50 ≤ 40
Glass Transition Temperature [°C] ≥ 300 ≥ 270 ≥ 300
5% Weight Reduction Temperature [°C] ≥ 500 ≥ 350 ≥ 450

Fluorine-free

GN-K Series LT-K Series PW-K Series
Features Low-temperature curable, thick film applicable Low-temperature curable, high resolution High sensitivity, high resolution
NMP-free 〇 〇 〇
Exposure Type Negative type Positive type Positive type
Developer Alkali Alkali Alkali
Cure Temperature [°C] ≥ 200 ≥ 200 ≥ 300