PRODUCTS

Non-Photodefinable Polyimide SEMICOFINE™

Technological Elements

SEMICOFINE™
SEMICOFINE™ is a polyimide coating material developed through a concentration of unique design technologies for polyimide heat-resistant resin. There are diverse products to meet every need, and these have been used for many years as protective films, insulation films, etc. for semiconductors/electronic components.

Features

1. High reliability (heat resistance, mechanical properties, insulation properties, chemical resistance)
2. Heat resistance of 500°C or above
3. A varied product lineup to match the application and process (Low CTE products, thin film/thick film process compatible products)

Applications/Usage

<Usage Method>

Usage Method Diagram

<Application Examples>

• Semiconductor Surface Protection Film (Buffer Coating)
• Wafer/Panel Level Package Redistribution Layer (RDL)
• Electronic Component Interlayer Insulation Film, Hollow Structure Formation Applications

Semiconductor Buffer Coating
Semiconductor Buffer Coating Diagram

Electronic Components
Electronic Component Diagram

Redistribution Layer (RDL)
Redistribution Layer (RDL) Diagram

Technology Information

<Product Characteristics>

SP Series
Cure Temperature [°C] 320 to 350
Tensile Strength [MPa] ≥ 180
Elongation [%] ≥ 20
Elastic Modulus [GPa] 2.9 to 4.4
CTE [ppm/°C] 1 to 40
Glass Transition Temperature [°C] ≥ 283
5% Weight Reduction Temperature [°C] ≥ 545