PRODUCTS

Polyimide Photodefinable Adhesive Film

Technological Elements

FALDA™
FALDA™ polyimide photodefinable adhesive film is a negative-type photoresist material that has been developed taking advantage of Toray photodefinable polyimide technology and sheet processing technology. It can be used for permanent film applications. With excellent heat resistance, insulation properties, and processability, it is ideal for use as an interlayer insulation film and in hollow structure (cavity) formation applications. We are also developing models for applications requiring high modulus of elasticity and low linear coefficient of thermal expansion (low CTE), etc.

Features

1. It has negative-type photosensitive characteristics, and unexposed portions can be removed with alkali developing. A positive type is also in development.
2. As it is a sheet type, it is ideal for thick film processing and hollow structure formation that is not possible with liquid types.
3. Because it has high heat resistance, it is ideal for applications that need high reliability.
4. It has excellent fluidity when laminating, so it enables flat embedding or adherence to uneven boards.
5. Product width and film thickness can be adjusted to suit the application.

Applications/Usage

FALDA™ Polyimide Photodefinable Adhesive Sheet is a product with cover film on both surfaces. It can be adhered to the base material with a laminator or press machine, with the cover film from one side removed. After adhesion, pattern processing can be performed with standard photolitho processes such as exposure, bake, or developing. After processing, performing the high heat (200°C or more) thermosetting process produces excellent mechanical strength, allowing use as a permanent film.

<Usage Method>

Usage Method Diagram

<Processing Examples>

Negative-type Pattern Processing Example (Film Thickness 20 µm)

L/S = 10/10 µm
L/S = 10/10 µm
20 µm Via
20 µm Via

Example of Hollow Structure Formation

Example of Hollow Structure Formation

Positive-type Sheet, Via Processing Example (Film Thickness 13 µm)

5 µm Via
5 µm Via
10 µm Via
10 µm Via

<Application Examples>

Sensor related, MEMS material, multilayer wiring substrate, etc.

Technology Information

<Product Characteristics>

Negative-type Representative Characteristics Positive-type (Development Product)
Tensile Strength [MPa] > 100 > 120
Elongation [%] > 10 > 10
Elastic Modulus [GPa] > 3 > 3
Film Stress [MPa] > 30 -
CTE [ppm/°C] <55 <55
Glass Transition Temperature [°C] > 250 > 260
5% Weight Reduction Temperature [°C] > 370 > 320