Photosensitive Conductive Material RAYBRID™ Wiring Formation Paste
RAYBRID™ paste for wiring formation (LCAG Series, HRAG Series) is a conductive paste with photosensitive properties. Toray's proprietary polymer design technology allows the formation of high-definition wiring, and is used mainly for touch panel wire routing, etc.
- High-definition wiring formation is possible with photolitho processing after coating with screen printing.
- As it is a photosensitive material, highly refined patterning is possible.
- As the curing temperature is low and it has high flexibility, it is suited for wiring formation on film boards.
- Compared to conventional pattern processes using photo resist, there are fewer steps and the process can be simplified.
After applying RAYBRID™ paste for wiring formation evenly to the board with screen printing, form the desired pattern with photolitho. Then sinter the pattern by applying a heat curing step of 140°C or above before use.
Contact, UV exposure
Trace Pattern Image
Application Examples: Smartphone touch sensor
|Resolution||Wiring Pattern: Line/Space = 10 µm/10 µm to 30 µm/30 µm|
|Electrical Resistance||Resistivity: 30 to 80 µΩ·cm
Sheet Resistance: 0.05 to 0.5 Ω/□
|Heat Cure Conditions||140°C|