Coating Material Photodefinable Polyimide PHOTONEECE™
PHOTONEECE™ is a liquid type photodefinable polyimide designed to accommodate various mechanical properties required by the makers of various semiconductor and electronic component makers around the globe. Product line-up consist of PW-Series (High temp. curable positive photodefinable), UR-Series (High temp. curable negative photodefinable), LT-Series (Low temp. curable positive photodefinable) and PN-Series (Low temp. curable negative photodefinable). These products are utilized for passivation and dielectric layers necessary for devices and components.
Features
- High reliability (high heat resistance, mechanical properties, dielectric constant and chemical resistance)
- Excellent photo sensitivity and patterning dimensional control
- Variety of product line-ups for maximum process versatility
Applications/Usage
- Buffer coating / Passivation for IC Chips
- Dielectric layers for RDL (WLP and PLP)
- Dielectric layers and cavity / MEMS formation for electronic components.
PHOTONEECE Process Example

Application Examples



Technology Information
Coating film characteristics
PW Series | PN Series | LT Series | ||
---|---|---|---|---|
Curing Temperature (1 hr) | 320 to 350°C | 200 to 350°C | 170 to 250°C | |
Tensile Strength | MPa | ≥ 150 | ≥ 110 | ≥ 120 |
Elongation | % | ≥ 20 | ≥ 20 | ≥ 60 |
Elastic Modulus | GPa | 3.8 to 4.0 | 3.3 to 3.9 | 1.7 to 2.5 |
Linear Expansion Coefficient | ppm/°C | 35 to 40 | 60 to 65 | 55 to 60 |
Glass transition temperature (Tg) | °C | ≥ 300 | ≥ 312 | ≥ 270 |
5% weight reduction temperature | °C | ≥ 450 | ≥ 382 | ≥ 340 |