Coating Material Photosensitive Polyimide PHOTONEECE™PHOTONEECE™

Overview

PHOTONEECE™ is a liquid type photosensitive polyimide designed to accommodate various mechanical properties required by the makers of various semiconductor and electronic component makers around the globe. Product line-up consist of PW-Series (High temp. curable positive photosensitive), UR-Series (High temp. curable negative photosensitive), LT-Series (Low temp. curable positive photosensitive) and PN-Series (Low temp. curable negative photosensitive). These products are utilized for passivation and dielectric layers necessary for devices and components.

Features

  1. High reliability (high heat resistance, mechanical properties, dielectric constant and chemical resistance)
  2. Excellent photo sensitivity and patterning dimensional control
  3. Variety of product line-ups for maximum process versatility

Applications/Usage

  1. Buffer coating / Passivation for IC Chips
  2. Dielectric layers for RDL (WLP and PLP)
  3. Dielectric layers and cavity / MEMS formation for electronic components.

PHOTONEECE Process Example

Application Examples

Semiconductor Buffer Coating
Semiconductor Buffer Coating
Electronic Components
Electronic Components
Rewiring layer
Rewiring layer

Technology Information

Coating film characteristics

PW Series PN Series LT Series
Curing Temperature (1 hr) 320 to 350°C 200 to 350°C 170 to 250°C
Tensile Strength MPa ≥ 150 ≥ 110 ≥ 120
Elongation % ≥ 20 ≥ 20 ≥ 60
Elastic Modulus GPa 3.8 to 4.0 3.3 to 3.9 1.7 to 2.5
Linear Expansion Coefficient ppm/°C 35 to 40 60 to 65 55 to 60
Glass transition temperature (Tg) °C ≥ 300 ≥ 312 ≥ 270
5% weight reduction temperature °C ≥ 450 ≥ 382 ≥ 340