Photosensitive Conductive Material RAYBRID™ Paste for Electronic Components
RAYBRID™ paste for electronic components (FHAG Series) is a conductive paste that has photosensitive characteristics. Toray's proprietary polymer design technology allows for the formation of high-definition thick film wiring, used mainly for electrode applications in electronic components.
- High-definition wiring formation is possible with photolitho processing after coating with screen printing.
- High-definition and thick wiring formation is possible with Toray's proprietary polymer design technology.
- By suppressing pattern shrinkage, it can be used even in high-heat sintering conditions exceeding 850°C.
- Suppressing the volatilization of solvents as much as possible during screen printing makes customer adjustment of viscosity unnecessary during the printing process.
After applying RAYBRID™ evenly to the board with screen printing, etc., form the desired pattern with photolitho. Then sinter the pattern by applying a baking step of 800°C or above before use.
Formation Pattern Image
|Resolution||Line/Space/Thickness = 15 µm/15 µm/10 µm|
|Electrical Resistance||Resistivity: < 3.0 µΩ·cm
Sheet Resistance: < 0.03 Ω/□@0.5 um
The structure/characteristics data noted are representative values. As the characteristics differ by product, we will recommend the ideal product to suit the customer's application. Please contact us for details.