Adhesive Film FALDA™ Polyimide High Heat Resistance Temporary Adhesive Film (Development Product)
FALDA™ polyimide high heat resistance temporary adhesive film is an ultra-high heat-resistant polyimide adhesive tape.
Our lineup of products with varied features offers solutions to customers.
*TBDB (Temporary Bonding De-Bonding)
- An ultra-high heat-resistant polyimide tape using polyimide adhesive.
- There is less adhesive transfer to the adherend when compared to silicone adhesives.
- Supports room-temperature lamination and room temperature delamination.
- A product lineup suitable for protection and transportation of electronic components.
Product Cross Section
TBDB has cover film on one surface. Remove the cover film just before lamination.
|Film Thickness||12.5 to 125 µm|
|Heat resistance (1% weight reduction)||400°C or more|
|Lamination/Release||Can support room temperature|