Adhesive Film FALDA™ Polyimide High Heat Resistance Temporary Adhesive Film (Development Product)FALDA™

Overview

FALDA™ polyimide high heat resistance temporary adhesive film is an ultra-high heat-resistant polyimide adhesive tape.
Our lineup of products with varied features offers solutions to customers.
*TBDB (Temporary Bonding De-Bonding)

Features

  1. An ultra-high heat-resistant polyimide tape using polyimide adhesive.
  2. There is less adhesive transfer to the adherend when compared to silicone adhesives.
  3. Supports room-temperature lamination and room temperature release.
  4. A product lineup suitable for protection and transportation of electronic components.

Product Cross Section

TBDB Tape Structure
TBDB Tape Structure

Applications/Usage

TBDB has cover film on one surface. Remove the cover film just before lamination.

[Process] Cover film removal > Lamination

Technology Information

Item Product Specifications/Features
Film Thickness 12.5 to 125 µm
Heat resistance (1% weight reduction) 400°C or more
Lamination/Release Can support room temperature