Adhesive Film FALDA™ Polyimide High Heat Resistance Temporary Adhesive Film (Development Product)
FALDA™ polyimide high heat resistance temporary adhesive film is an ultra-high heat-resistant polyimide adhesive tape.
Our lineup of products with varied features offers solutions to customers.
*TBDB (Temporary Bonding De-Bonding)
Features
- An ultra-high heat-resistant polyimide tape using polyimide adhesive.
- There is less adhesive transfer to the adherend when compared to silicone adhesives.
- Supports room-temperature lamination and room temperature delamination.
- A product lineup suitable for protection and transportation of electronic components.
Product Cross Section

Applications/Usage
TBDB has cover film on one surface. Remove the cover film just before lamination.
![[Process] Cover film removal > Lamination](../images/img_028.jpg)
Technology Information
Item | Product Specifications/Features |
---|---|
Film Thickness | 12.5 to 125 µm |
Heat resistance (1% weight reduction) | 400°C or more |
Lamination/Release | Can support room temperature |