Adhesive Film FALDA™Polyimide Low Dielectric/Low Dielectric Loss Tangent Adhesive Film (Development Product)
FALDA™ polyimide low dielectric/low dielectric loss tangent adhesive film is a thermosetting film adhesive suitable for Next-generation high-speed/high-frequency telecommunication applications.
Features
- Polyimide resin design achieves a dielectric loss tangent of 0.006 at 20 GHz.
- In addition to high heat resistance, it also achieves high strength and high elasticity.
- Can be provided at thicknesses up to 400 µm.
Applications/Usage
FALDA™ polyimide low dielectric/low dielectric loss tangent adhesive film has a cover film on both surfaces and supports laser via processing.
Processing Process
Via Processing
Application Examples
Technology Information
| Product No. | LDA-30 | LPDA-10 | |
|---|---|---|---|
| Features | Non-Photodefinable | Photodefinable | |
| Sheet Thickness (µm) | 25 to 200 µm | 10 to 25 µm | |
| Dielectric Constant | 20 GHz | 2.41 | 2.71 |
| Dielectric Loss Tangent | 20 GHz | 0.003 | 0.0072 |
| Tg (°C) | 185 | 120 | |
| CTE (ppm) | 70 | 70 | |
| Elastic Modulus (GPa) @23°C | 1.5 | 1.7 | |
| Tensile Strength (MPa) | 52 | 65 | |
| Elongation (%) | 10 | 15 | |
| Water Absorption Ratio (%) | 0.2 | 0.6 | |
| Adhesion Strength (N/cm) | 10 | - | |
| Curing Conditions | 180°C × 60 min | 200°C × 60 min | |