Adhesive Film FALDA™Polyimide Low Dielectric/Low Dielectric Loss Tangent Adhesive Film (Development Product)FALDA™

Overview

FALDA™ polyimide low dielectric/low dielectric loss tangent adhesive film is a thermosetting film adhesive suitable for Next-generation high-speed/high-frequency telecommunication applications.

Features

  1. Polyimide resin design achieves a dielectric loss tangent of 0.006 at 20 GHz.
  2. In addition to high heat resistance, it also achieves high strength and high elasticity.
  3. Can be provided at thicknesses up to 400 µm.

Applications/Usage

FALDA™ polyimide low dielectric/low dielectric loss tangent adhesive film has a cover film on both surfaces and supports laser via processing.

Processing Process

Processing Process

Via Processing

Via Processing

Application Examples

Sheet Material: Package for high-frequency devices
Sheet Material: High-frequency inductor

Technology Information

Product No. LDA-30 LPDA-10
Features Non-Photosensitive Photosensitive
Sheet Thickness (µm) 25 to 200 µm 10 to 25 µm
Dielectric Constant 20 GHz 2.41 2.71
Dielectric Loss Tangent 20 GHz 0.003 0.0072
Tg (°C) 185 120
CTE (ppm) 70 70
Elastic Modulus (GPa) @23°C 1.5 1.7
Tensile Strength (MPa) 52 65
Elongation (%) 10 15
Water Absorption Ratio (%) 0.2 0.6
Adhesion Strength (N/cm) 10 -
Curing Conditions 180°C × 60 min 200°C × 60 min