Adhesive Film FALDA™ Polyimide Highly Thermal-Conductive Adhesive Film (Development Product)

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FALDA™ polyimide high thermal conduction adhesive film is a heat curing sheet-type adhesive with high heat resistance properties and high insulation properties. We will design/propose to match applications for thermal conductivity, fusion viscosity, and film thickness.

Features

Adhesive Type

1. High thermal conductivity of 10 W/mK or more
2. Excellent handling properties
3. Achieves stress mitigation when adhering disparate materials.

Bonding Type

1. Extremely low interface thermal resistance.
2. Heat resistance of 200°C or more.

Applications/Usage

Ideal for applications requiring heat dissipation, such as power devices, automotive components, LEDs, and semiconductor manufacturing equipment components.

Application Examples

Technology Information

Changes in heat resistance in a thermal cycle test

SAT photo comparison after thermal cycle test

Characteristics of High Thermal Conduction Adhesive Film